Call for Proposal Announcement
Automotive Systems, Robotics, Computer Science;
Biotechnology, Chinese Medicine, Electronics, Microelectronics, Energy, Environmental Protection, Quantum Technology;
Information and Communication Technologies, Logistics, and Supply Chain Management;
Nanotechnology and Materials Science, Testing and Certification, and Textiles / Clothing / Footwear
Platform Projects: not specify
Seed Projects: up to HKD 1.4 or 2.8 million
Platform Projects: 2 years
Seed Projects: 18 months
5 Sep 2022
30 Sep 2022
System opens on:
4 Jul 2022
Synopsis of the Scheme
ITSP (Platform & Seed) aims to support applied research and development (R&D) projects undertaken by R&D Centres or designated Hong Kong public research institutes to transfer the R&D results to Hong Kong industries. And it especially allows part of the research work to be carried out on the mainland.
ITSP (Platform & Seed) supports two types of R&D projects, namely platform and seed projects. Platform projects refer to applied R&D projects which aim to benefit the industry collectively or certain sectors of it and have the potential for commercialization. Seed projects are exploratory and forward-looking, providing the foundation for future applied R&D projects.
- The lead applicant must be a Hong Kong R&D Centre or a designated Hong Kong public research institute.
- Faculties members of HKUST(GZ) can participate as Co-Investigator (Co-I).
For detailed eligibility requirements, please refer to the program guidelines.
Applicants shall submit the proposal via ITC Funding Administrative System.
- Up to 50% of the R&D work of the project can be conducted (and relevant expenditure incurred) in the Mainland.
- All platform projects require industry sponsorship of at least 10% of the total project cost from at least one company, while sponsorship requirement is not mandatory for seed projects.
Research Department, HKUST(GZ)
T: 020 8833 8991
E: email@example.com / firstname.lastname@example.org